EPG 2601[M]

ADBOND EPG 2601M is formulated for bonding of honeycomb structures and capable of working under harsh space environments such as thermo-vacuum, thermal cycling, radiation etc. The main feature of this material is that it is thermally conducting and can retain its property at very low temperatures.

 ADBOND EPG 2601M is a two part chemically reactive epoxy structural adhesive system consists of polyether modified epoxide resin, filler, rheological additive and colorant in the resin part, curing agent and accelerator in the hardener part. Cure is achieved by mixing the hardener part with resin part packed separately.

Some of the specialties of this material are minimum cure shrinkage combined with excellent adhesion, superior strength & toughness and low out gassing

 

Typical properties/ characteristics

1

Color& consistency

Part A: Black, viscous resin, Part B: Brownish yellow

2

Viscosity (ps)

1000 to4000

3

Sp. Gravity

1.65

4

Hardness (Shore D)

≥70

5

Lap shear strength (ksc) on Alumina at RT

>120

6

Thermal conductivity (cal/cm/C/s)

8* 10 –4

7

Coeft. of thermal expansion (/ oC)

3.5 x 10-5 – 10 x 10-5

7

Volume Resistivity (ohm- cm)

6* 10 12

8

Out gassing

 
 

    - TML (%)

<1

 

    - CVCM (%)

<0.05

11

Service temperature

93 K to 373 K

 

TECHNOLOGY TRANSFER FROM ISRO

 

ISRO is willing to offer the knowhow of this technology to suitable entrepreneurs / industries in India. Capable manufacturing industries interested in acquiring this knowhow may write with details of their present activities, requirements and plans for implementation, infrastructure and technical expertise available with them, their own market assessment, if any, and plans for diversification to the address given below:

Head

Technology Transfer & Industrial Coordination Division (TT&IC)

Vikram Sarabhai Space Centre, ISRO PO

Thiruvananthapuram-695 022

E mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

Ph: 0471-2564081

Fax: 0471-2564134