RTV SILICONE SINGLE PART ADHESIVE, SILCEM R9

Indian Space Research Organisation at its Vikram Sarabhai Space Centre (VSSC) has developed a room temperature curable single part adhesive, SILCEM R9 based on polysiloxane for multipurpose bonding applications. This system contains polysiloxane, fillers and curing components mixed under dehumidified conditions and filled inside squeeze tubes for ready – to - use condition. The adhesive can be squeezed out from the tube and very conveniently applied directly on the substrates and bonded. On exposure to humid air, it hardens by itself to a solid rubbery mass.

Salient Features

  • Single part siloxane based system containing fillers and special curing components.
  • Room temperature curable on exposure to humid air. Safe inside the tube
  • Easy to apply. Simply squeeze and apply
  • Supplied in ready-to -use squeeze tubes of 100-150 g capacity
  • Meets the aerospace quality standards

Typical Properties / characteristics:

PROPERTY

 

Density (cured product) g/cc

1.25 - 1.35

Tensile strength @ RT ksc

22 - 42

 

Tensile strength @120°C ksc

18 - 35

Elongation @RT %

225 - 350

Elongation@120°C %

110-300

Lap shear strength ( Al-Al) @ RT ksc

13-30

Lap shear strength( Al-Al) @ 120°C ksc

13-28

Thermal conductivity at 100°C W/ m.K

0.25-0.50

Specific heat at 100°C, J /g/°C

1.0-2.0

Hardness, Shore A

40-55

 

Applications

This adhesive finds large societal applications for use as sealants to provide leak proof joints. This material can also be used as a gap filler materials where high temperatures are experienced. Being a water repellant adhesive material, the bonded substrates maintains good strength even under wet conditions. It finds applications as a general purpose adhesive for bonding / sealing materials like wood, metals, leathers, foams etc.

TECHNOLOGY TRANSFER FROM ISRO

ISRO is willing to offer the knowhow of this technology to suitable entrepreneurs / industries in India. Capable manufacturing industries interested in acquiring this know-how and scale-up the technology, may write with details of their present activities, requirements and plans for implementation, infrastructure and technical expertise available with them, their own market assessment, if any, and plans for diversification to the address given below.

For further details, please contact: 

Smt U Sreerekha

Technology Transfer & Industrial Co-Ordination division (TT&IC)

Vikram Sarabhai Space Centre,

Thiruvananthapuram-695 022

E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

Ph: 0471-2564081, Fax: 0471-2564134